Tempalux CN-F
(conductive polyetherimide) |
Download
Product Brochure (pdf) |
Non-sloughing carbon-fiber-filled
material which is extremely strong and stiff, has excellent
dimensional stability, and high temperature resistance to 415°
F. This material has broad chemical resistance and excellent
fabrication finishing characteristics. UL94 V-0 rated.
The following physical property
information is based on typical values of the resin.
|
|
Mechanical Properties |
| |
Units |
ASTM Test |
Result |
| Tensile Strength @yield |
psi |
D368 |
29,000 |
| Tensile Elongation @break |
% |
D368 |
2.0 |
| Flexural Strength |
psi |
D790 |
38,000 |
| Flexural Modulus |
psi |
D790 |
1,860,000 |
| Izod Impact Strength-Notched |
ft·lbs/in |
D256 |
1.4 |
| Izod Impact Strength Un-Notched |
ft·lbs/in |
D256 |
7.5 |
| Hardness–Shore D |
|
D2240 |
92 |
|
|
Thermal Properties |
| |
Units |
ASTM Test |
Result |
| Heat Deflection Temp. @264 psi |
°F |
D648 |
417 |
| Coefficient of Thermal Expansion |
in/in/°F |
D696 |
2.2 * 10-5 |
| Flammability Rating–UL94 @ .58" |
|
|
V-O |
|
|
Electrical Properties |
| |
Units |
ASTM Test |
Result |
| Surface Resistivity |
ohm/cm |
D257 |
103 - 105 |
| Volume Resistivity |
ohm/cm |
D257 |
103 - 105 |
|
|
Other Properties |
| |
Units |
ASTM Test |
Result |
| Specific Gravity |
|
D792 |
1.34 |
| Water Absorption @24 hours |
% |
D570 |
0.45 |
|
|
| Applications
Include: |
| • Semiconductor/electronic
components |
| • Hard disk drive assembly fixtures |
| • Aerospace test equipment |
| Advantages of
Tempalux CN-F: |
| • Tight conductivity range |
| • Economical to competitive products |
| • Excellent high heat compatibility |
| • Superior strength and stiffness |
| • Excellent dimensional stability |
| • UL 94 V-0 rated |
| • Non-sloughing |
| Manufacturing
Capabilities: |
| Sheet: 3/8" to 4" thick |
| *In addition to our standard
capabilities, Westlake also has the ability to process custom
resins in various sizes and colors with some exceptions. |
| Tempalux® is a resistered trademark
of Westlake Plastics Co. |
|